Soldering Buckle Heat Sink Plates Complex Module Thermal Solution Application

High-performance soldering buckle heat sink complex module designed for demanding thermal management applications. This advanced solution combines aluminum skived fin technology with CNC machining for optimal heat dissipation performance.

Advanced heat pipe technology enhances traditional radiator and heat exchange systems. Available in natural cooling and forced air cooling configurations for diverse applications including power electronics, IGBT, transformers, high-power power supplies, LED lamps, servers, computers, and medical equipment.

The heat pipe heat sink operates through a sealed system containing wick structure and steam passage. During operation, the evaporation section absorbs heat from the source, converting liquid to steam. This steam travels to the cooling section, condenses back to liquid, and returns via capillary action to complete the continuous heat dissipation cycle.

• Multi-component construction: base plate + dense fins + flow guide structure/liquid cooling cavity
• Fins secured to base plates via welding/brazing/buckling methods
• Thin, dense, tall fins providing substantial heat dissipation area
• Air-cooled + water-cooled composite structure capability
• Ideal for ultra-high power, high temperature, and space-constrained applications

• Large heat dissipation area with performance exceeding standard aluminum extrusion/shovel tooth designs
• Optimized fin design balancing wind resistance and heat exchange efficiency
• High structural strength with excellent vibration and earthquake resistance
• Customizable configurations for specialized and high-power modules
• Reliable long-term operation in high-power-density equipment

• Fin stamping and forming
• CNC machining of base plate
• Fin fastening/plugging/assembly
• Vacuum brazing/furnace welding/laser welding
• Polishing, stress-relieving, and surface treatment
• Airtightness and strength testing

• High-power power supplies and inverters
• New energy vehicle electronic control and motor systems
• Energy storage converter PCS
• Laser equipment
• RF/Microwave power amplifiers
• Servers, GPUs, and AI computing equipment
• Industrial transmission and high-frequency equipment